发明名称 |
Printed circuit board and manufacturing process thereof |
摘要 |
<p>A printed circuit board and a manufacturing method thereof can realize a thick film laminated structure of single resin material of low dielectric constant without reinforcement material. The printed circuit board is formed with an insulation layer of composite structure of a first resin material of low dielectric constant and a first general base material having different relative dielectric constants, and the insulation layer is disposed between conductor circuits. <IMAGE></p> |
申请公布号 |
EP1094692(B1) |
申请公布日期 |
2015.08.19 |
申请号 |
EP20000122871 |
申请日期 |
2000.10.20 |
申请人 |
NEC CORPORATION |
发明人 |
MORI, SHIGERU;ONO, YOSHINORI |
分类号 |
H05K3/46;H05K1/02;H05K1/03 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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