发明名称 GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE
摘要 In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.
申请公布号 KR20150094781(A) 申请公布日期 2015.08.19
申请号 KR20157020345 申请日期 2013.12.20
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 HIYAMA TSUTOMU
分类号 H05K3/34;B23K1/008 主分类号 H05K3/34
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