发明名称 圧縮成形方法及び装置
摘要 Provided are a compression molding method and device for light-emitting device reflectors for which mold resin utilization rate is improved and molding quality is improved such that resin flash does not occur. The reflector (3) is compression molded by: supplying molding resin (26) into recessed cavities (16), in which a release film (21) is held by adsorption, and filling the resin around pressing pins (17); aligning a workpiece with the recessed cavities (16) and placing the workpiece in contact with a clamper block (14) and the pressing pins (17) through the release film (21); clamping the workpiece using the mold (8); and moving the bottoms of the recessed cavities (16) relative to the workpiece to bring same closer to the workpiece by further clamping of the workpiece.
申请公布号 JP5764821(B2) 申请公布日期 2015.08.19
申请号 JP20110183501 申请日期 2011.08.25
申请人 アピックヤマダ株式会社 发明人 池田 正信;中山 英雄
分类号 H01L21/56;B29C43/18;B29C43/56;H01L33/52 主分类号 H01L21/56
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