| 摘要 |
A condition monitor device monitors at least one of vibration and temperature of a piece of equipment, the condition monitor device preferably includes an enclosure within which is located at least one vibration sensor and at least one temperature sensor. A processor is located in the enclosure and is connected to at least one of the sensors for analyzing signals produced therefrom. A storage device is located in the enclosure for storing of the analyzed signals. The monitor may be mounted on the piece of equipment and the condition monitor is able to be connected, either wireless or wired, to a secondary device. |
