| 摘要 |
<p>The purpose of the present invention is to selectively dispose a fluorescent material of an LED element merely on a necessary portion, i.e., on an LED chip. In this LED device manufacturing method, the following steps are performed: a step of disposing a fluorescent material by applying and drying a fluorescent material-diffused liquid on a package having an LED chip mounted thereon, said fluorescent material-diffused liquid containing fluorescent material particles; a step of forming a fluorescent material layer by applying a binder precursor merely to the fluorescent material disposed on a specific portion that includes a portion on the LED chip, and adhering the fluorescent material on the specific portion by firing; and a step of removing, by cleaning, the fluorescent material disposed on portions other than the specific portion.</p> |
