| 发明名称 | Package systems and manufacturing methods thereof | ||
| 摘要 | A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates. | ||
| 申请公布号 | US9112001(B2) | 申请公布日期 | 2015.08.18 |
| 申请号 | US201414173406 | 申请日期 | 2014.02.05 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 发明人 | Shu Chia-Pao;Cheng Chun-wen;Chang Kuei-Sung;Huang Hsin-Ting;Tsai Shang-Ying;Peng Jung-Huei |
| 分类号 | H01L21/30;H01L21/768;B81C1/00;H01L23/00;H01L25/065 | 主分类号 | H01L21/30 |
| 代理机构 | Lowe Hauptman & Ham, LLP | 代理人 | Lowe Hauptman & Ham, LLP |
| 主权项 | 1. A method of forming a package system, the method comprising: providing a first substrate having a metallic pad and at least one metallic guard ring, wherein the metallic pad protrudes above a top surface of the first substrate; and bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates. | ||
| 地址 | TW | ||