Fan out package, semiconductor device and manufacturing method thereof

摘要

A fan out package includes a molding compound, a conductive plug in the molding compound, a dielectric covering the molding compound and a portion of the conductive plug, and an interconnect disposed over the dielectric and contacted with the conductive plug, wherein a width of the interconnect contacting the conductive plug is substantially smaller than a width of the conductive plug in the molding compound, and a width of the interconnect disposed over the dielectric is substantially greater than the width of the conductive plug in the molding compound.

主权项

1. A fan out package, comprising:
a molding compound including a first portion and a second portion; a conductive plug interposed between the first portion of the molding compound and the second portion of the molding compound; a dielectric covering the molding compound and a portion of the conductive plug; and an interconnect disposed over the dielectric and contacted with the conductive plug, wherein the interconnect includes a first portion overlaid the first portion of the molding compound, a second portion overlaid the second portion of the molding compound and a third portion contacting the conductive plug, and a width of the third portion of the interconnect is substantially smaller than a width of the conductive plug in the molding compound, and a width of the first portion of the interconnect and the second portion of the interconnect is substantially greater than the width of the conductive plug in the molding compound.