Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof

摘要

Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes encapsulating a device stack within a molded panel having a frontside and a backside. The device stack contains an upper semiconductor die and an interconnect buffer layer, which is formed over the upper semiconductor die and which is covered by the frontside of the molded panel. Material is removed from the frontside the molded panel to expose the interconnect buffer layer therethrough. One or more frontside redistribution layers are produced over the frontside of the molded panel and electrically coupled to the upper semiconductor die through the interconnect buffer layer. The molded panel is then singulated to yield a microelectronic package including a molded package body containing the device stack.

主权项

1. A method for fabricating a microelectronic package, comprising:
encapsulating a device stack within a molded panel having a frontside and a backside, the device stack comprising:
an upper semiconductor die;an interconnect buffer layer formed over the upper semiconductor die and covered by the frontside of the molded panel; andan inner molded body surrounding the upper semiconductor die and underlying the interconnect buffer layer; removing material from the frontside the molded panel to expose the interconnect buffer layer therethrough; producing one or more frontside redistribution layers over the frontside of the molded panel and electrically coupled to the upper semiconductor die through the interconnect buffer layer; and singulating the molded panel to yield a microelectronic package including a molded package body containing the device stack and surrounding the inner molded body and the interconnect buffer layer.