Position detection apparatus with a magnetic flux detecting substrate

摘要

A position detection apparatus includes: a sensor substrate having a detection region in which position detecting electrodes are formed and a wiring line region in which wiring lines led out from the position detecting electrodes are disposed; a processing circuit connected to the wiring lines of the sensor substrate and configured to carry out a predetermined signal process based on a signal from the sensor substrate; and a housing having the sensor substrate placed thereon and having the processing circuit provided therein; the sensor substrate placed on the housing having a through-hole provided therein in the proximity of the detection region for allowing the wiring lines to be threaded therethrough.

主权项

1. A position detection apparatus, comprising:
a sensor substrate integrally including a detection region, in which position detecting electrodes are formed, and a wiring line region, in which wiring lines led out from said position detecting electrodes are disposed, the wiring line region including a lead wiring line region, and the sensor substrate including a top surface and a bottom surface; a magnetic flux detecting substrate provided beneath the bottom surface of the sensor substrate and having one or more loop coils formed thereon for detecting magnetic fluxes generated by a coil provided in a position pointer; a processing circuit provided adjacent to the magnetic flux detecting substrate, the processing circuit being connected to said wiring lines of said sensor substrate via said lead wiring line region of said sensor substrate, and configured to carry out a predetermined signal process based on a signal from said sensor substrate; a housing having an accommodation surface, on which said sensor substrate is supported, and an internal space, in which said magnetic flux detecting substrate is placed at a position beneath the sensor substrate and said processing circuit is placed adjacent to the magnetic flux detecting substrate such that the processing circuit and the sensor substrate do not overlap as viewed along a direction perpendicular to the top surface of the sensor substrate, the housing defining a through-hole at a periphery of the accommodation surface, and said lead wiring line region of the sensor substrate supported on the accommodation surface being threaded through the through-hole into the internal space of the housing to connect to the processing circuit placed therein; and a sheet member disposed over the top surface of said sensor substrate, the sheet member being sized to cover the accommodation surface including the through-hole, wherein said sensor substrate includes two cutaway portions respectively formed at two corners between an outer periphery of said sensor substrate and two side edges of said lead wiring line region.