发明名称 Methods of containing defects for non-silicon device engineering
摘要 An apparatus including a device including a channel material having a first lattice structure on a well of a well material having a matched lattice structure in a buffer material having a second lattice structure that is different than the first lattice structure. A method including forming a trench in a buffer material; forming an n-type well material in the trench, the n-type well material having a lattice structure that is different than a lattice structure of the buffer material; and forming an n-type transistor. A system including a computer including a processor including complimentary metal oxide semiconductor circuitry including an n-type transistor including a channel material, the channel material having a first lattice structure on a well disposed in a buffer material having a second lattice structure that is different than the first lattice structure, the n-type transistor coupled to a p-type transistor.
申请公布号 US9112028(B2) 申请公布日期 2015.08.18
申请号 US201414263708 申请日期 2014.04.28
申请人 Intel Corporation 发明人 Goel Niti;Pillarisetty Ravi;Mukherjee Niloy;Chau Robert S.;Rachmady Willy;Metz Matthew V.;Le Van H.;Kavalieros Jack T.;Radosavljevic Marko;Chu-Kung Benjamin;Dewey Gilbert;Sung Seung Hoon
分类号 H01L21/02;H01L29/78;H01L21/84;H01L27/12;H01L21/8238;H01L27/092 主分类号 H01L21/02
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. An apparatus comprising: a semiconductor device comprising a channel material having a first lattice structure on a well of a well material having a matched lattice structure, the well disposed in a buffer material having a second lattice structure that is different than the first lattice structure, wherein the well comprises dimensions of a height greater than each of a width and a length.
地址 Santa Clara CA US
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