SHIELD PLATE MANUFACTURING METHOD FOR SPUTTERING DEVICE AND SHIELD PLATE THEREOF

摘要

The present invention relates to a shield plate manufacturing method of a sputtering device and a shield plate manufactured thereby. The purpose of the present invention is to cut down personnel expenses to easily remove a metal layer attached to the shield plate in the sputtering work and improve productivity. In case of the manufacturing method of the shield plate mounted to protect a wall side inside a vacuum chamber in the sputtering device which deposits a metal thin film on a semiconductor device such as a wafer or a PET film inside the vacuum chamber, the present invention comprises: a) a step of washing and preheating a shield plate (10) after sanding (S10); b) a step of attaching a sticker (20) including a space unit (20b) in the shield plate (10) (S20); c) a step of partially forming a ceramic coating layer (12) on the shield plate (10) by spraying a liquid ceramic with a spray mode (S30); d) a step of stripping the sticker (20) (S40); and e) a step of heating and drying the shield plate (10) (S50).