| 发明名称 |
Joining a chip to a substrate with solder alloys having different reflow temperatures |
| 摘要 |
A method including identifying a first connection location on a chip having a first connection type and a second connection location on the chip having a second connection type, applying a first solder alloy to the first connection location, heating the first solder alloy to a temperature sufficient to cause the first solder alloy to reflow, applying a second solder alloy to the second connection location, and heating the second solder alloy to a temperature sufficient to cause the second solder alloy to reflow. |
| 申请公布号 |
US9111793(B2) |
申请公布日期 |
2015.08.18 |
| 申请号 |
US201314013182 |
申请日期 |
2013.08.29 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Pharand Sylvain |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
Kelly L. Jeffrey;Schnurmann H. Daniel |
| 主权项 |
1. A method comprising:
identifying a first connection location on a chip having a first connection type and a second connection location on the chip having a second connection type; applying a first solder alloy to the first connection location; heating the first solder alloy to a temperature sufficient to cause the first solder alloy to reflow; applying a second solder alloy to the second connection location; and heating the second solder alloy to a temperature sufficient to cause the second solder alloy to reflow. |
| 地址 |
Armonk NY US |
