| 摘要 |
<p>The present invention relates to a method for manufacturing a coupon (printed circuit board) and, more particularly, to a method for preventing the misapplication of a core product in the bonding operation of an inner core. The detection coupon for the bonding core misapplication of the printed circuit board according to the present invention includes a pad a11, a pad a12, a pad a13, a pad a14, a pad a21 connected to the pad a11, an inner via hole (IVH) a41 which connects third to eighth layers, a laser via hole a31 which is connected to the pad a12, a laser via hole a32 which is connected to the pad a13, a pad a22 connected to the pad a14, and an inner via hole a42 which connects the third to eighth layers. The present invention reduces the number of manufacturing processes by using a multi build-up laser (MBL) processing method.</p> |
