| 发明名称 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board | ||
| 摘要 | Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms. | ||
| 申请公布号 | US9110371(B2) | 申请公布日期 | 2015.08.18 |
| 申请号 | US201314403233 | 申请日期 | 2013.05.28 |
| 申请人 | HITACHI CHEMICAL COMPANY, LTD | 发明人 | Itagaki Katsutoshi;Shindou Masanori |
| 分类号 | G03F7/032;H05K3/06;H05K3/10;G03F7/085;G03F7/20;H05K3/24;H05K3/18 | 主分类号 | G03F7/032 |
| 代理机构 | Fitch, Even, Tabin & Flannery LLP | 代理人 | Fitch, Even, Tabin & Flannery LLP |
| 主权项 | 1. A photosensitive resin composition, comprising: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms. | ||
| 地址 | Tokyo JP | ||