Packaging substrate

摘要

A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

主权项

1. A packaging substrate, comprising:
a substrate body having a plurality of conductive pads disposed on a surface thereof; an insulating protective layer formed on the surface of the substrate body and having openings for the conductive pads to be exposed therefrom; and conductive pillars disposed on end surfaces of the conductive pads exposed from the openings and having first ends, opposite second ends, and side surfaces adjacent to the first ends and the second ends, the first ends being closer than the second ends from the conductive pads, and the first ends having a width bigger than a width of the second ends, wherein the side surfaces are arc concave toward centers of the conductive pillars.