发明名称 Power semiconductor device and fabrication method thereof
摘要 A power semiconductor device includes a cell region on a semiconductor substrate, at least a transistor device in the cell region, a peripheral termination region encompassing the cell region, a plurality of epitaxial islands arranged around the cell region, and a grid type epitaxial layer in the peripheral termination region. The grid type epitaxial layer separates the plurality of epitaxial islands from one another.
申请公布号 US9111770(B2) 申请公布日期 2015.08.18
申请号 US201414509071 申请日期 2014.10.08
申请人 Anpec Electronics Corporation 发明人 Lin Yung-Fa;Chang Chia-Hao
分类号 H01L29/06;H01L29/78;H01L27/088;H01L29/40;H01L29/49 主分类号 H01L29/06
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A power semiconductor device, comprising: a cell region on a semiconductor substrate; at least one transistor device disposed in the cell region; a peripheral termination region surrounding the cell region; a transition region interposed between the cell region and the peripheral termination region; a guard ring doping region in the transition region; a gate structure disposed on the guard ring doping region; a field oxide layer on the peripheral termination region; a field plate on the field oxide layer; a plurality of islands of first epitaxial layer disposed in the peripheral termination region; and a grid-shaped second epitaxial layer in the peripheral termination region, the grid-shaped second epitaxial layer surrounds each of the plurality of islands of first epitaxial layer to thereby separate the plurality of islands of first epitaxial layer from one another.
地址 Hsinchu Science Park, Hsin-Chu TW