Method for manufacturing laminated ceramic electronic component

摘要

A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.

主权项

1. A method for manufacturing a laminated ceramic electronic component, the method comprising:
preparing a laminate chip having a stacked plurality of ceramic layers and a plurality of internal electrodes, and wherein opposed end edges of the internal electrodes are exposed at first and second side surfaces of the laminate chip; forming a first insulator section by applying a paste on the first side surface of the laminate chip by pressing the laminate chip against a metal plate with a volume of grooves filled with the paste; forming a second insulator section by applying the paste on the second side surface of the laminate chip by pressing the laminate chip against the metal plate; and firing the laminate chip with the first insulator section and the second insulator section formed thereon, wherein the paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies C≧(S×t/(V/2))×100, where t represents a guaranteed thickness (μm) of an insulating layer, S represents an area (μm2) of a surface with the insulating layer formed thereon, and V represents a groove volume (μm3) of the metal plate corresponding to one laminate chip.