发明名称 Assembly structure of power amplifier
摘要 An assembly structure of a power amplifier is provided. The assembly structure comprises at least two power amplifier modules, each power amplifier module comprises a heat-conducting board, an amplifier tube matching circuit board is assembled on the heat-conducting board; at least one radio frequency power amplifier tube is assembled on the amplifier tube matching circuit board, assembly directions of all the radio frequency power amplifier tubes are parallel to each other; the heat-conducting boards of adjacent two power amplifier modules are connected vertically along a transmission direction of the radio frequency signal. Comparing with the existing plane assembly technology, the application has a character of needing small assembly areas, which is adapted in an assembly environment with a certain height and small assembly areas.
申请公布号 US9112456(B2) 申请公布日期 2015.08.18
申请号 US201214386565 申请日期 2012.04.06
申请人 Wuhan Gewei Electronic Technology Co., Ltd. 发明人 Meng Qingnan
分类号 H05K7/20;H03F1/30;H04B1/03;H04N1/036 主分类号 H05K7/20
代理机构 Hamre, Schumann, Mueller & Larson, P.C. 代理人 Hamre, Schumann, Mueller & Larson, P.C.
主权项 1. An assembly structure of a power amplifier, wherein the assembly structure comprises at least two power amplifier modules, each of the power amplifier modules includes a heat-conducting board; an amplifier tube matching circuit board is assembled on the heat-conducting board; at least one radio frequency power amplifier tube is assembled on the amplifier tube matching circuit board; assembly directions of each of the radio frequency power amplifier tubes are parallel to each other; heat-conducting boards of adjacent two power amplifier modules are vertically connected with each other along a transmission direction of a radio frequency signal; one or several kinds of components selected from a microstrip line, a cable line and an electronic element are arranged on the amplifier tube matching circuit board; a connecting method of an AC signal or a DC signal between the said power amplifier modules is one or several kinds of connecting methods selected from a microstrip line connection, a cable connection, a connecting element connection.
地址 Wuhan CN