发明名称 Switch circuit package module
摘要 A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other.
申请公布号 US9111928(B2) 申请公布日期 2015.08.18
申请号 US201313760079 申请日期 2013.02.06
申请人 DELTA ELECTRONICS (SHANGHAI) CO., LTD. 发明人 Li Zeng;Hong Shou-Yu;Zeng Jian-Hong
分类号 H01L25/00;H01L23/495;H01L23/64 主分类号 H01L25/00
代理机构 CKC & Partners Co., Ltd. 代理人 CKC & Partners Co., Ltd.
主权项 1. A switch circuit package module, comprising: at least a semiconductor switch unit comprising: a first semiconductor switch element; anda second semiconductor switch element, wherein each of the first semiconductor switch element and the second semiconductor switch element comprises a plurality of sub micro-switch elements; and at least a capacitor unit, wherein the capacitor unit is stacked on a surface of the semiconductor switch unit and comprises a plurality of capacitors configured in a form of array pattern, wherein the capacitors are configured to cooperate with the sub micro-switch elements, such that impedances of multiple commutation loops between the capacitors and the sub micro-switch elements are close to or the same with each other.
地址 Shanghai CN