发明名称 |
Switch circuit package module |
摘要 |
A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes sub micro-switch elements. The capacitor unit is arranged at a periphery of the semiconductor switch unit or stacked on a surface of the semiconductor switch unit, such that impedances of commutation loops between the capacitor unit and the sub micro-switch elements are close to or the same with each other. |
申请公布号 |
US9111928(B2) |
申请公布日期 |
2015.08.18 |
申请号 |
US201313760079 |
申请日期 |
2013.02.06 |
申请人 |
DELTA ELECTRONICS (SHANGHAI) CO., LTD. |
发明人 |
Li Zeng;Hong Shou-Yu;Zeng Jian-Hong |
分类号 |
H01L25/00;H01L23/495;H01L23/64 |
主分类号 |
H01L25/00 |
代理机构 |
CKC & Partners Co., Ltd. |
代理人 |
CKC & Partners Co., Ltd. |
主权项 |
1. A switch circuit package module, comprising:
at least a semiconductor switch unit comprising:
a first semiconductor switch element; anda second semiconductor switch element, wherein each of the first semiconductor switch element and the second semiconductor switch element comprises a plurality of sub micro-switch elements; and at least a capacitor unit, wherein the capacitor unit is stacked on a surface of the semiconductor switch unit and comprises a plurality of capacitors configured in a form of array pattern, wherein the capacitors are configured to cooperate with the sub micro-switch elements, such that impedances of multiple commutation loops between the capacitors and the sub micro-switch elements are close to or the same with each other. |
地址 |
Shanghai CN |