Semiconductor device with step portion having shear surfaces

摘要

A semiconductor device includes a source electrode pad formed to a front surface of a semiconductor chip and a metal clip (metal plate) to which a lead is electrically connected. The metal clip includes a chip-connecting portion electrically connected to the source electrode pad via a conductive bonding material, a lead-connecting portion electrically connected to the lead via a conductive bonding material, and an intermediate portion positioned between the chip-connecting portion and the lead-connecting portion. Further, between the intermediate portion and the chip-connecting portion, a step portion, which has shear surfaces disposed to face each other, is provided interposing a joining portion.

主权项

1. A semiconductor device comprising:
a chip-mounting portion made of a metal having a chip-mounting surface; a semiconductor chip having a front surface to which a first electrode and a second electrode are formed and a back surface positioned opposite to the front surface to which a third electrode is formed, and mounted to the chip-mounting portion via a first conductive bonding material; a first lead disposed to be separated from the chip-mounting portion and electrically connected to the first electrode; a second lead disposed to be separated from the chip-mounting portion and the first lead and electrically connected to the second electrode; and a metal plate having a chip-connecting portion electrically connected to the second electrode via a second conductive bonding material, a lead-connecting portion electrically connected to the second lead via a third conductive bonding material, and an intermediate portion positioned between the chip-connecting portion and the lead-connecting portion and electrically connecting the second electrode and the second lead, wherein the metal plate has: the chip-connecting portion, the intermediate portion, and the lead-connecting portion arranged in this order from above the second electrode of the semiconductor chip along a first direction; a first step portion provided between the intermediate portion and the chip-connecting portion; and a lower surface of the intermediate portion positioned at a higher position from the chip-mounting surface than a lower surface of the chip-connecting portion, the first step portion has: a first joint portion for joining the intermediate portion and the chip-connecting portion; a first shear surface formed toward the front surface of the semiconductor chip from a lower end of the first joint portion and connected to the lower surface of the chip-connecting portion; and a second shear surface formed toward a direction opposite to the semiconductor chip from an upper end of the first joint portion and connected to an upper surface of the chip-connecting portion.