In situ-built pin-grid arrays for coreless substrates, and methods of making same

摘要

A coreless pin-grid array (PGA) substrate includes PGA pins that are integral to the PGA substrate without the use of solder. A process of making the coreless PGA substrate integrates the PGA pins by forming a build-up layer upon the PGA pins such that vias make direct contact to pin heads of the PGA pins.

主权项

1. A process of forming a coreless pin-grid array substrate comprising:
forming a seed layer upon a pin-grid array pin mold; forming a PGA precursor film on the seed layer; patterning the PGA precursor film to achieve a plurality of spaced-apart PGA pins; and forming a coreless PGA substrate that integrates the PGA pins including:
forming a first interlayer to define a land side of the coreless PGA substrate, wherein the first interlayer contacts the PGA pins at pin heads thereof;filling a via into the first interlayer, wherein the via makes direct contact with a pin head of the PGA pins; andforming a subsequent interlayer to define near a die side of the coreless PGA substrate.