System and method for electrical testing of through silicon vias (TSVs)

摘要

An embodiment of a testing system for carrying out electrical testing of at least one first through via extending, at least in part, through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the first through via and to electrical-connection elements carried by the first body for electrical connection towards the outside; the first electrical test circuit enables detection of at least one electrical parameter of the first through via through the electrical-connection elements.

主权项

1. An apparatus, comprising:
a first layer of semiconductor material; a first conductive via disposed in the first layer; and a testing circuit operable to allow testing of the first conductive via comprising:
a first conductive pad disposed over and electrically coupled to the first layer;a second conductive pad disposed over the first layer;a third conductive pad disposed over the first layer;a switch element having a control node and coupled between the first conductive via and the second conductive pad; anda control circuit having an input node coupled to the third conductive pad and having an output node coupled to the control node of the switch.