| 发明名称 |
Method for forming a semiconductor device assembly having a heat spreader |
| 摘要 |
A method includes providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate, dispensing an interface material on the IC die, positioning a portion of a heat spreader in contact with the interface material, and dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate. |
| 申请公布号 |
US9111878(B2) |
申请公布日期 |
2015.08.18 |
| 申请号 |
US201313755904 |
申请日期 |
2013.01.31 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC |
发明人 |
Higgins, III Leo M.;Carpenter Burton J. |
| 分类号 |
H01L21/00;H01L23/31;H01L21/56;H01L23/36;H01L23/42 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing an integrated circuit (IC) die assembly that includes a substrate and an IC die mounted on a portion of a major surface of the substrate; dispensing a thermal interface material on the IC die; positioning a portion of a heat spreader in contact with the thermal interface material; and after the positioning the portion of the heat spreader in contact with the thermal interface, dispensing an adhesive between one side of the heat spreader facing the IC die assembly and exposed portions of a major surface of an encapsulant on the substrate wherein the dispensing the adhesive is performed so that the adhesive is in contact with the major surface of the encapsulant on the substrate and at least a portion of the one side of the heat spreader. |
| 地址 |
Austin TX US |
