发明名称 Probe card and testing apparatus
摘要 Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder.
申请公布号 US9110098(B2) 申请公布日期 2015.08.18
申请号 US201313930658 申请日期 2013.06.28
申请人 Kabushiki Kaisha Nihon Micronics 发明人 Mikuni Katsushi;Kikuchi Yoshinori;Onuma Yoshihito;Kudo Toshiyuki
分类号 G01R31/00;G01R1/073;G01R31/28 主分类号 G01R31/00
代理机构 Procopio, Cory, Hargreaves & Savitch LLP 代理人 Procopio, Cory, Hargreaves & Savitch LLP
主权项 1. A probe card comprising: a plurality of probes that come into contact with a plurality of electrodes of a device under test; a probe board that includes the plurality of probes provided thereon; a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon; a connector that includes a connection pin and a holder, the connection pin electrically connecting a line of the probe board and a line of the wiring board, and the holder holding the connection pin between the probe board and the wiring board; and a first electronic part that is mounted on a probe board side-facing surface of the wiring board that is opposite an upper surface of the wiring board and placed in a mounting space on the probe board side surface of the wiring board, the mounting space being formed where the connection pin is not placed, to enable space-efficient placement of the first electronic part in a manner that substantially prevents deterioration in electrical characteristics of the first electronic part and makes additional space available on the upper surface of the wiring board, the mounting space being formed by a through hole or a recess provided in the holder.
地址 Tokyo JP
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