Power semiconductor device and method for producing a power semiconductor device

摘要

A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.

主权项

1. A power semiconductor device comprising:
a power semiconductor module having
electrically conductive conductor tracks,a cooling plate having
a first cooling housing component with a cutout passing therethrough, anda second cooling housing component connected to said first cooling housing component, andan electrically non-conductive insulation layer disposed between said conductor tracks and said cooling plate; a heat sink through which a liquid can flow; and at least one at least one power semiconductor component arranged on said electrically conductive conductor tracks of said power semiconductor module, wherein said cooling plate is arranged in said cutout; wherein said first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at said side of said cooling plate which faces away from said at least one at least one power semiconductor component; wherein said cooling plate is connected to said first cooling housing component by a first weld seam which extends circumferentially around said cooling plate; and wherein said first weld seam seals said cooling plate relative to said first cooling housing component.