发明名称 |
Pattern formation method |
摘要 |
According to one embodiment, a pattern formation method includes forming a layer above an underlying layer. The layer includes a block copolymer. The method further includes forming a first phase including a first polymer and a second phase including a second polymer in the layer by phase-separating the block copolymer, and selectively removing the first phase by dry etching the layer using an etching gas including carbon monoxide. |
申请公布号 |
US9111875(B2) |
申请公布日期 |
2015.08.18 |
申请号 |
US201414202494 |
申请日期 |
2014.03.10 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Yamamoto Hiroshi;Imamura Tsubasa;Hayashi Hisataka;Omura Mitsuhiro |
分类号 |
B44C1/22;H01L21/308;H01L21/311 |
主分类号 |
B44C1/22 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
主权项 |
1. A pattern formation method comprising:
forming a layer above an underlying layer, the layer including a block copolymer; forming a first phase including a first polymer and a second phase including a second polymer in the layer by phase-separating the block copolymer, the first polymer including no benzene ring in a chemical formula thereof, and the second polymer including a benzene ring in a chemical formula thereof; and selectively removing the first phase by dry etching the layer using an etching gas including carbon monoxide and hydrogen, wherein a flow rate ratio of the carbon monoxide to a total amount of the hydrogen and the carbon monoxide is 40% or more. |
地址 |
Tokyo JP |