发明名称 Pattern formation method
摘要 According to one embodiment, a pattern formation method includes forming a layer above an underlying layer. The layer includes a block copolymer. The method further includes forming a first phase including a first polymer and a second phase including a second polymer in the layer by phase-separating the block copolymer, and selectively removing the first phase by dry etching the layer using an etching gas including carbon monoxide.
申请公布号 US9111875(B2) 申请公布日期 2015.08.18
申请号 US201414202494 申请日期 2014.03.10
申请人 Kabushiki Kaisha Toshiba 发明人 Yamamoto Hiroshi;Imamura Tsubasa;Hayashi Hisataka;Omura Mitsuhiro
分类号 B44C1/22;H01L21/308;H01L21/311 主分类号 B44C1/22
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
主权项 1. A pattern formation method comprising: forming a layer above an underlying layer, the layer including a block copolymer; forming a first phase including a first polymer and a second phase including a second polymer in the layer by phase-separating the block copolymer, the first polymer including no benzene ring in a chemical formula thereof, and the second polymer including a benzene ring in a chemical formula thereof; and selectively removing the first phase by dry etching the layer using an etching gas including carbon monoxide and hydrogen, wherein a flow rate ratio of the carbon monoxide to a total amount of the hydrogen and the carbon monoxide is 40% or more.
地址 Tokyo JP