Manufacturing method of solid-state imaging apparatus, solid-state imaging apparatus, and electronic imaging apparatus

摘要

A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member.

主权项

1. A solid-state imaging apparatus, comprising:
a solid-state imaging device including a light receiving region in a main face of the solid-state imaging device; a light transmitting member provided at a position apart from the light receiving region and including an extending portion which is at least a part of the light transmitting member and is extended from the solid-state imaging device; and a holding member for holding the light transmitting member and including a space where the solid-state imaging device is arranged, wherein a lower face of the extending portion of the light transmitting member is fixed to an upper face of a portion surrounding the space of the holding member, the portion surrounding the space of the holding member includes a positioning portion projected into the space, and a side of the solid-state imaging device is in contact with the positioning portion.