| 发明名称 | Method for molding a low pressure molded strain relief for coaxial connector interconnection | ||
| 摘要 | A strain relief for a coaxial cable and coaxial connector interconnection is provided as an injection moldable polymer material surrounding the interconnection. The injection moldable material fills a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body, strengthening and environmentally sealing the interconnection. | ||
| 申请公布号 | US9108348(B2) | 申请公布日期 | 2015.08.18 |
| 申请号 | US201113251341 | 申请日期 | 2011.10.03 |
| 申请人 | CommScope Technologies LLC | 发明人 | Van Swearingen Kendrick;Carlock James J.;Fleming James P. |
| 分类号 | B29C65/00;B29C45/14;H01R9/05;H01R13/58;B29L31/00 | 主分类号 | B29C65/00 |
| 代理机构 | Babcock IP, PLLC | 代理人 | Babcock IP, PLLC |
| 主权项 | 1. A method for manufacturing a strain relief for a coaxial cable and coaxial connector interconnection, comprising: injection molding a polymer material around the interconnection; the injection moldable material filling a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body. | ||
| 地址 | Hickory NC US | ||