Valve controlled, node-level vapor condensation for two-phase heat sink(s)

摘要

Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.

主权项

1. A cooling apparatus comprising:
at least one heat sink to cool at least one electronic component of an electronic subsystem of multiple electronic subsystems of an electronics rack, the at least one heat sink comprising at least one coolant-carrying channel for a first coolant to flow therethrough, the first coolant providing two-phase cooling to the at least one electronic component, and being discharged from the at least one heat sink as coolant exhaust with coolant vapor; a node-level condensation module disposed within the electronic subsystem comprising the at least one electronic component, the node-level condensation module being coupled in fluid communication with the at least one heat sink and receiving the coolant exhaust therefrom, the node-level condensation module being liquid-cooled via a second coolant to facilitate condensing the coolant vapor in the received coolant exhaust within the electronic subsystem before return to a rack-level coolant return manifold of the electronics rack, the node-level condensation module comprising a liquid-to-liquid heat exchanger providing conductive heat transfer from the first coolant to the second coolant to facilitate condensing of the first coolant vapor in the node-level condensation module; a controller automatically controlling at least one of the liquid-cooling of the at least one heat sink or the liquid-cooling of the node-level condensation module; and a control valve for adjusting a flow rate of the second coolant to the node-level condensation module, the control valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.