Electronic circuit board, assembly and a related method thereof

摘要

An apparatus includes a substrate and a plurality of conductive traces formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.

主权项

1. An apparatus comprising: a substrate, wherein the substrate comprises a ceramic material; a plurality of conductive traces formed on the substrate, the plurality of conductive traces comprising a co-deposited conductive material doped with 1-5% by volume of an aluminum material that is annealed to form a protective layer on selective portions of a surface of the conductive traces, the protective layer having a thickness of less than approximately 500 nm to inhibit oxidation; and
a set of first metal contact pads in contact with the surface of the plurality of conductive traces and in electrical communication with the plurality of conductive traces, wherein the substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic ceramic circuit board configured to operate at a temperature between 200 and 1130 degrees Celsius.