Thermal management of photonics assemblies

摘要

A photonics assembly (8-16) is housed within an hermetically sealed container (24) mounted within an outer container (20), and is cooled by a fluidic arrangement comprising a liquid flow path (28) defined between the outer container and the sealed container, the outer container having a liquid inlet and a liquid outlet (30, 32), whereby cooling liquid can flow around the hermetically sealed container to remove heat. The photonics assembly including photonics devices, has a composite thermally conductive substrate (17, 19) contacting a thermally conductive wall (22) of the sealed container, whereby the cooling liquid cools said photonics devices. Liquid flow passageways (48-66) are provided in wall (22) and substrate (17, 19) for improving fluidic cooling.

主权项

1. A thermal management apparatus for an electrical and/or optical component assembly, comprising:
an hermetically sealed container mounted within an outer container, the outer container having a liquid inlet and a liquid outlet, said outer container and said hermetically sealed container configured to define a liquid path operable to direct a liquid within the outer container and around the hermetically sealed container to remove heat therefrom, and the hermetically sealed container containing said component assembly, which assembly includes one or more devices, which devices are in thermal communication with a thermally conductive wall portion of said sealed container, whereby said liquid cools said devices, wherein at least two of the devices that are contained within the outer container are also contained within the hermetically sealed container.