发明名称 |
Enclosure for a multi-channel modulator driver |
摘要 |
Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed. |
申请公布号 |
US9113549(B2) |
申请公布日期 |
2015.08.18 |
申请号 |
US201113309424 |
申请日期 |
2011.12.01 |
申请人 |
TriQuint Semiconductor, Inc. |
发明人 |
Steinbeiser Craig;Dinh Khiem;Chiu Anthony |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
Withrow & Terranova, P.L.L.C. |
代理人 |
Withrow & Terranova, P.L.L.C. |
主权项 |
1. A system, comprising:
a substrate; a multi-channel modulator driver mounted on the substrate; and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having:
a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel; anda top region coupled with the wall, the wall and the top region being composed of an electrically conductive polymer; wherein the wall includes a first portion that has the electrically conductive polymer covered by a metal and a second portion that has the electrically conductive polymer not covered by the metal. |
地址 |
Hillsboro OR US |