发明名称 Enclosure for a multi-channel modulator driver
摘要 Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.
申请公布号 US9113549(B2) 申请公布日期 2015.08.18
申请号 US201113309424 申请日期 2011.12.01
申请人 TriQuint Semiconductor, Inc. 发明人 Steinbeiser Craig;Dinh Khiem;Chiu Anthony
分类号 H05K9/00 主分类号 H05K9/00
代理机构 Withrow & Terranova, P.L.L.C. 代理人 Withrow & Terranova, P.L.L.C.
主权项 1. A system, comprising: a substrate; a multi-channel modulator driver mounted on the substrate; and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having: a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel; anda top region coupled with the wall, the wall and the top region being composed of an electrically conductive polymer; wherein the wall includes a first portion that has the electrically conductive polymer covered by a metal and a second portion that has the electrically conductive polymer not covered by the metal.
地址 Hillsboro OR US