发明名称 Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
摘要 A method for manufacturing a light-absorbing substrate having a surface with depressions and projections comprises a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate.
申请公布号 US9108269(B2) 申请公布日期 2015.08.18
申请号 US201113388595 申请日期 2011.07.19
申请人 HAMAMATSU PHOTONICS K. K. 发明人 Shimoi Hideki;Araki Keisuke
分类号 B44C1/22;B23K26/00;B23K26/36;H01L31/0236 主分类号 B44C1/22
代理机构 Drinker Biddle & Reath LLP 代理人 Drinker Biddle & Reath LLP
主权项 1. A method for manufacturing a light-absorbing substrate having a surface with depressions and projections, the method comprising: a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause the surface of the substrate to be reached at each modified region by at least one of: (i) a modified region itself reaching the surface, or (ii) a fracture that originates from the modified region reaching the surface; in the first step, the substrate is irradiated with the laser light a plurality of times while changing the distance between the surface of the substrate and a converging point of the laser light so as to form, in an area corresponding to a depression, a plurality of the modified regions aligned along a thickness direction of the substrate; and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate, wherein the depressions are each independently formed by etching progressing from the modified region or the fracture as a start point, and wherein the plurality of modified regions are formed in matrix form.
地址 Hamamatsu-shi, Shizuoka JP