发明名称 LED LIGHT SOURCE PACKAGE
摘要 <p>Provided is an LED light source package. The LED light source package includes: a circuit board; a light source which is received on the upper side of the circuit board; and a lens structure which is disposed on an upper part of the light source, and comes in contact with the circuit board. The lens structure may include a first inclined surface which protrudes toward the light source as the surface facing the light source becomes closer to the center of the lens structure.</p>
申请公布号 KR20150093282(A) 申请公布日期 2015.08.18
申请号 KR20140013715 申请日期 2014.02.06
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 YOON, BYUNG SEO;HWANG, SEONG YONG;KIM, KYUNG MIN;PARK, YOUNG MIN
分类号 H01L33/58;H01L33/48 主分类号 H01L33/58
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