| 发明名称 | Package-on-package semiconductor device | ||
| 摘要 | A semiconductor device and method of forming the semiconductor device, the semiconductor device includes a package having at least one first die and at least one second die. The semiconductor device further includes a set of conductive elements electrically connecting the at least one first and the at least one second die to a substrate. The semiconductor device further includes a thermal contact pad between the at least one first die and the at least one second die, to thermally isolate the at least one first die from the at least one second die. | ||
| 申请公布号 | US9111896(B2) | 申请公布日期 | 2015.08.18 |
| 申请号 | US201313803609 | 申请日期 | 2013.03.14 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 发明人 | Yu Chen-Hua;Yeh Der-Chyang |
| 分类号 | H01L23/34;H01L21/56;H01L23/00;H01L23/31;H01L23/36;H01L23/373;H01L23/498;H01L25/03;H01L25/065 | 主分类号 | H01L23/34 |
| 代理机构 | Lowe Hauptman & Ham, LLP | 代理人 | Lowe Hauptman & Ham, LLP |
| 主权项 | 1. A semiconductor device comprising: a package having at least one first die and at least one second die; a set of conductive elements electrically connecting the at least one first die and the at least one second die to a substrate; a thermal contact pad between the at least one first die and the at least one second die, for thermally isolating the at least one first die from the at least one second die; and a molding compound over the substrate, wherein the molding compound is between a portion of thermal contact pad and at least one conductive element of the set of conductive elements. | ||
| 地址 | TW | ||