具有导电墨水的积体电路封装系统及制造该积体电路的方法;INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD OF MANUFACTURE THEREOF

摘要

一种积体电路封装系统及其制法包括：具有一接触垫的一积体电路晶粒；在该接触垫上的一重分配层，该重分配层具有一晶片接点、一线路及一凸块垫，该重分配层具有一弧形顶面与平坦的侧壁；位在该重分配层的该等侧壁上的一上钝化层，该重分配层之凸块垫上方的区域系外露于该上钝化层；以及附着于该凸块垫上的一外部互连件。; a redistribution layer on the contact pad, the redistribution layer having a chip contact, a trace, and a bump pad, the redistribution layer having a curved top surface and sidewalls which are planar; an upper passivation layer on the sidewalls of the redistribution layer with the area above the bump pad of the redistribution layer exposed from the upper passivation layer; and an external interconnect attached over the bump pad.