发明名称 DETERGENT COMPOSITION FOR REMOVING SOLDER FLUX RESIDUE
摘要 PROBLEM TO BE SOLVED: To provide a detergent composition suitable for cleaning a flux residue remaining in a crevice of a soldered component. ! SOLUTION: Provided is a detergent composition for removing a solder flux residue of one or a plurality of embodiments, comprising diethylene glycol monobutyl ether (component A-1), diethylene glycol monohexyl ether (component A-2), a compound represented by the following formula (I) (component B), a polyalkylene glycol alkylamine-type nonionic surfactant (component C), and water (component D). A content of component A-1 is 40.0 mass% or more, a content of component A-2 is 40.0 mass% or more and 54.6 mass% or less, a content of component B is 0.3 mass% or more and 5.0 mass% or less, and a content of component C is 0.1 mass% or more and 5.0 mass% or less. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015145476(A) 申请公布日期 2015.08.13
申请号 JP20140018695 申请日期 2014.02.03
申请人 KAO CORP 发明人 OHASHI HIDEMI
分类号 C11D3/20;B08B3/02;B08B3/08;B08B3/12;C11D1/72;C11D3/22;C11D3/30;C11D3/43;C23G1/20 主分类号 C11D3/20
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