| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition that excels in heat resistance, low water absorption, rigidity at high temperature, chemical resistance, fluidity and low warpage property, sufficiently promotes crystallization even when the resin is molded in a mold at 80°C, and causes little contamination of a mold in manufacturing a molded article. ! SOLUTION: The polyamide resin composition comprises a polyamide resin (A) and sheet silicate (B). The polyamide resin (A) comprises a polyamide (a-1) having a number average molecular weight of 2000 or more by 95 to 99.95 mass% and a polyamide oligomer (a-2) having a number average molecular weight of 500 or more and less than 2000 by 0.05 to 5 mass%, in which 25 mol% or more of monomer units in the whole monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are derived from specific alicyclic monomers, and the content ratio of trans isomer structural units derived from the above alicyclic monomers is 50 to 85 mol%. ! |
