发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 A semiconductor device according to an embodiment includes a semiconductor layer. A first conductivity-type source layer is provided in the semiconductor layer. A second conductivity-type drain layer is provided in the semiconductor layer. A gate dielectric film is provided on the semiconductor layer between the source layer and the drain layer. A gate electrode includes a first gate part partially provided on the gate dielectric film on a side of the source layer and a second gate part partially provided on the gate dielectric film on a side of the drain layer. A length of crystal grains of the first gate part in a channel length direction is longer than that of crystal grains of the second gate part in the channel length direction.
申请公布号 US2015228787(A1) 申请公布日期 2015.08.13
申请号 US201414288074 申请日期 2014.05.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 GOTO Masakazu
分类号 H01L29/78;H01L21/28;H01L29/49 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device comprising: a semiconductor layer; a first conductivity-type source layer in the semiconductor layer; a second conductivity-type drain layer in the semiconductor layer; a gate dielectric film on the semiconductor layer between the source layer and the drain layer; and a gate electrode comprising a first gate part partially located on the gate dielectric film on a side of the source layer and a second gate part partially located on the gate dielectric film on a side of the drain layer, wherein a length of crystal grains of the first gate part in a channel length direction is longer than that of crystal grains of the second gate part in the channel length direction.
地址 Tokyo JP