发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor device according to an embodiment includes a semiconductor layer. A first conductivity-type source layer is provided in the semiconductor layer. A second conductivity-type drain layer is provided in the semiconductor layer. A gate dielectric film is provided on the semiconductor layer between the source layer and the drain layer. A gate electrode includes a first gate part partially provided on the gate dielectric film on a side of the source layer and a second gate part partially provided on the gate dielectric film on a side of the drain layer. A length of crystal grains of the first gate part in a channel length direction is longer than that of crystal grains of the second gate part in the channel length direction. |
申请公布号 |
US2015228787(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201414288074 |
申请日期 |
2014.05.27 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
GOTO Masakazu |
分类号 |
H01L29/78;H01L21/28;H01L29/49 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a semiconductor layer; a first conductivity-type source layer in the semiconductor layer; a second conductivity-type drain layer in the semiconductor layer; a gate dielectric film on the semiconductor layer between the source layer and the drain layer; and a gate electrode comprising a first gate part partially located on the gate dielectric film on a side of the source layer and a second gate part partially located on the gate dielectric film on a side of the drain layer, wherein a length of crystal grains of the first gate part in a channel length direction is longer than that of crystal grains of the second gate part in the channel length direction. |
地址 |
Tokyo JP |