DIMMABLE LIGHT-EMITTED DIODE (LED) PACKAGING STRUCTURE

摘要

A dimmable light-emitted diode (LED) packaging structure is described. The dimmable LED packaging structure employs a plurality of first fluorescent layers respectively positioned on some of a plurality of first types of LED chips to solve the problems of color temperature and light mixing uniformity. Further, a second fluorescent layer overlays the first fluorescent layers and a potion of the first types of LED chips to simplify the manufacturing step of dimmable LED packaging structure.

主权项

1. A dimmable light-emitted diode (LED) packaging structure, comprising:
a substrate; an annual sidewall disposed on the substrate; a plurality of first types of LED chips disposed on the substrate within the annual sidewall, wherein each of the first types of LED chips emits a light ray; a plurality of first fluorescent layers disposed on one portion of the first types of LED chips correspondingly; and a second fluorescent layer filled within the annual sidewall for overlaying the first fluorescent layers and the other portion of the first types of LED chips; wherein when the one portion of the first types of LED chips emit the light rays through the first fluorescent layers and the second fluorescent layer and when the other portion of the first types of LED chips emit the light rays through the second fluorescent layer, the light rays on a surface of the first fluorescent layers are mixed with a surface of the other portion of the first types of LED chips for dimming the LED.