| 发明名称 |
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME |
| 摘要 |
Disclosed herein are a package substrate and a semiconductor package using the same. The package substrate includes a circuit area in which a circuit pattern is formed and a dummy area in which a dummy pattern is formed to surround the circuit area. |
| 申请公布号 |
US2015228567(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201414273306 |
申请日期 |
2014.05.08 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Ha Job |
| 分类号 |
H01L23/495;H05K1/02 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package substrate comprising:
a circuit area in which a circuit pattern is formed; and a dummy area in which a dummy pattern is formed to surround the circuit area. |
| 地址 |
Suwon-Si KR |
