| 摘要 |
A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire. |
| 主权项 |
1. A semiconductor device comprising:
a resin package; a semiconductor chip sealed in the resin package, and having first and second pads on a front surface; an island with projecting terminal sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of which is partially exposed from a bottom surface of the resin package as a first terminal; and a lead formed separately from the island with the projecting terminal, sealed in the resin package, one surface of which is connected with the second pad electrically, and the other surface of which is exposed from the bottom surface of the resin package as a second terminal capable of electrical connection between the second pad and outside, wherein a center of mass of the semiconductor chip is away from a center of the resin package, the projecting terminal is same as large as the lead, and solder to be formed under the semiconductor device spreads to the projecting terminal of the island. |
