发明名称 |
Surface mountable integrated circuit packaging scheme |
摘要 |
<p>An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate. I fl C:(IZ</p> |
申请公布号 |
AU2008230024(B2) |
申请公布日期 |
2015.08.13 |
申请号 |
AU20080230024 |
申请日期 |
2008.10.20 |
申请人 |
SIBEAM, INC |
发明人 |
DOAN, CHINH HUY;ALI, MOHAMMED ERSHAD |
分类号 |
H01L21/82;H01Q9/00;H05K1/02 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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