| 摘要 |
This wiring film for a flat panel display comprises a laminate structure which is formed by laminating a first layer, which includes at least one type of high melting-point metal selected from the group consisting of Mo, Ti, Cr, W, and Ta, and a second layer, which comprises an Al alloy that includes at least 0.01 atom% but less than 0.2 atom% of at least one from among the rare earth elements, Ni, and Co. In this wiring film, even when subjected to a thermal history of high temperatures from 400-500°C, inclusive, increase in wiring resistance is suppressed, hillocks or the like do not occur, and heat resistance is excellent. |
