发明名称 LED ELEMENT, AND PRODUCTION METHOD THEREFOR
摘要 The LED element has a conductive layer formed on the upper layer of the support substrate; a conductive oxide film layer formed on the upper layer of the conductive layer and made of a material having a thermal expansion coefficient of 1×10−6/K or more and 1×10−5/K or less; a light-emitting layer; a third semiconductor layer made of an n-type nitride semiconductor formed on the upper layer of the light-emitting layer; and an electrode formed at a position facing the conductive oxide film layer in a vertical direction so that a bottom surface of the electrode is in contact with a portion of an upper surface of the third semiconductor layer.
申请公布号 US2015228862(A1) 申请公布日期 2015.08.13
申请号 US201314428168 申请日期 2013.09.05
申请人 USHIO DENKI KABUSHIKI KAISHA 发明人 Miyoshi Kohei;Tsukihara Masashi
分类号 H01L33/42;H01L33/40;H01L33/32;H01L33/00 主分类号 H01L33/42
代理机构 代理人
主权项 1. An LED element containing a nitride semiconductor, comprising: a support substrate made of a conductor or a semiconductor; a conductive layer formed on the upper layer of the support substrate; a conductive oxide film layer formed on the upper layer of the conductive layer; a first semiconductor layer made of a p-type nitride semiconductor formed so that a bottom surface of the first semiconductor layer is in contact with a portion of an upper surface of the conductive layer and a portion of an upper surface of the conductive oxide film layer; a second semiconductor layer formed on the upper layer of the first semiconductor layer and made of a p-type nitride semiconductor having a lower concentration than that of the first semiconductor layer; a light-emitting layer made of a nitride semiconductor formed on the upper layer of the second semiconductor layer; a third semiconductor layer made of an n-type nitride semiconductor formed on the upper layer of the light-emitting layer; and an electrode formed at a position facing the conductive oxide film layer in a vertical direction so that a bottom surface of the electrode is in contact with a portion of an upper surface of the third semiconductor layer, wherein the conductive oxide film layer is made of a material having a thermal expansion coefficient of 1×10−6/K or more and 1×10−5/K or less.
地址 Tokyo JP