发明名称 |
LED ELEMENT, AND PRODUCTION METHOD THEREFOR |
摘要 |
The LED element has a conductive layer formed on the upper layer of the support substrate; a conductive oxide film layer formed on the upper layer of the conductive layer and made of a material having a thermal expansion coefficient of 1×10−6/K or more and 1×10−5/K or less; a light-emitting layer; a third semiconductor layer made of an n-type nitride semiconductor formed on the upper layer of the light-emitting layer; and an electrode formed at a position facing the conductive oxide film layer in a vertical direction so that a bottom surface of the electrode is in contact with a portion of an upper surface of the third semiconductor layer. |
申请公布号 |
US2015228862(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201314428168 |
申请日期 |
2013.09.05 |
申请人 |
USHIO DENKI KABUSHIKI KAISHA |
发明人 |
Miyoshi Kohei;Tsukihara Masashi |
分类号 |
H01L33/42;H01L33/40;H01L33/32;H01L33/00 |
主分类号 |
H01L33/42 |
代理机构 |
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代理人 |
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主权项 |
1. An LED element containing a nitride semiconductor, comprising:
a support substrate made of a conductor or a semiconductor; a conductive layer formed on the upper layer of the support substrate; a conductive oxide film layer formed on the upper layer of the conductive layer; a first semiconductor layer made of a p-type nitride semiconductor formed so that a bottom surface of the first semiconductor layer is in contact with a portion of an upper surface of the conductive layer and a portion of an upper surface of the conductive oxide film layer; a second semiconductor layer formed on the upper layer of the first semiconductor layer and made of a p-type nitride semiconductor having a lower concentration than that of the first semiconductor layer; a light-emitting layer made of a nitride semiconductor formed on the upper layer of the second semiconductor layer; a third semiconductor layer made of an n-type nitride semiconductor formed on the upper layer of the light-emitting layer; and an electrode formed at a position facing the conductive oxide film layer in a vertical direction so that a bottom surface of the electrode is in contact with a portion of an upper surface of the third semiconductor layer, wherein the conductive oxide film layer is made of a material having a thermal expansion coefficient of 1×10−6/K or more and 1×10−5/K or less. |
地址 |
Tokyo JP |