| 发明名称 |
LIGHT RECEIVING ELEMENT, IMAGE CAPTURING ELEMENT INCLUDING THE LIGHT RECEIVING ELEMENT AND IMAGE CAPTURING APPARATUS INCLUDING THE IMAGE CAPTURING ELEMENT |
| 摘要 |
A light receiving element includes a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. Also, there are provided an image capturing element including the light receiving element, and an image capturing apparatus including the image capturing element. |
| 申请公布号 |
US2015228685(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514609601 |
申请日期 |
2015.01.30 |
| 申请人 |
Sony Corporation |
发明人 |
UCHIDA Shiro;ABE Hideshi;WATANABE Tomomasa;YOSHIDA Hiroshi |
| 分类号 |
H01L27/146;H01L31/105;H01L31/0304;H01L31/0224 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light receiving element, comprising:
a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. |
| 地址 |
Tokyo JP |
