SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor device includes a wiring substrate, a first semiconductor chip flip-chip connected to the wiring substrate, a first underfill resin filled between the wiring substrate and the first semiconductor chip, the first underfill resin including a pedestal portion arranged in a periphery of the first semiconductor chip, a second semiconductor chip flip-chip connected to the first semiconductor chip, and being larger in area than the first semiconductor chip, and a second underfill resin filled between the first semiconductor chip and the second semiconductor chip, the second underfill resin covering an upper face of the pedestal portion of the first underfill resin and a side face of the second semiconductor chip.

主权项

1. A semiconductor device, comprising:
a wiring substrate; a first semiconductor chip flip-chip connected on the wiring substrate; a first underfill resin filled between the wiring substrate and the first semiconductor chip, the first underfill resin including a pedestal portion arranged in a periphery of the first semiconductor chip; a second semiconductor chip flip-chip connected on the first semiconductor chip, and being larger in area than the first semiconductor chip; and a second underfill resin filled between the first semiconductor chip and the second semiconductor chip, the second underfill resin covering an upper face of the pedestal portion of the first underfill resin and a side face of the second semiconductor chip.