SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE

摘要

In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.

主权项

1. A semiconductor device, comprising:
a die attach pad; a major surface of the die attach pad; a semiconductor die mounted on the major surface; an adhesive material configured to adjoin the semiconductor die and the die attach pad; an encapsulant covering the die attach pad, the adhesive material and the semiconductor die; and an interlock structure sandwiched between the semiconductor die and the major surface of the die attach pad, wherein the interlock structure is an integral portion of the die attach pad and the interlock structure engages the adhesive material so as to interlock the die attach pad and the adhesive material.