| 发明名称 |
CHIP PACKAGE AND METHOD FOR FORMING THE SAME |
| 摘要 |
A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. |
| 申请公布号 |
US2015228536(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514618413 |
申请日期 |
2015.02.10 |
| 申请人 |
XINTEC INC. |
发明人 |
HO Yen-Shih;LIU Tsang-Yu;LIN Chia-Sheng;CHENG Chia-Ming;CHANG Shu-Ming;TSENG Tzu-Wen |
| 分类号 |
H01L21/768;H01L21/302;H01L23/50 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a semiconductor substrate; a recess in the semiconductor substrate and adjoining a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from a bottom of the recess; and a conducting layer disposed on the semiconductor substrate and extending into the recess. |
| 地址 |
Taoyuan City TW |
