| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition that excels in heat resistance, low water absorption, rigidity at high temperature, fluidity and light fastness, sufficiently promotes crystallization even when it is molded in a mold at 80°C, and causes little contamination of a mold in manufacturing a molded article. ! SOLUTION: The polyamide resin composition comprises a polyamide resin (A) and apatite (B). The polyamide resin (A) comprises a polyamide (a-1) having a number average molecular weight of 2000 or more by 95 to 99.95 mass% and a polyamide oligomer (a-2) having a number average molecular weight of 500 or more and less than 2000 by 0.05 to 5 mass%, in which 25 mol% or more of monomer units in the whole monomer units constituting the polyamide (a-1) and the polyamide oligomer (a-2) are derived from specific alicyclic monomers, and the content ratio of trans isomer structural units derived from the above alicyclic monomers is 50 to 85 mol%. ! COPYRIGHT: (C)2015,JPO&INPIT |
